The VLSI Packaging Workshop in Japan has been held every two years since 1992 in Kyoto, and it has become a well-known international workshop for advanced packaging technologies. Due to ever increasing activities and changing demands, the committee has reviewed its mission, cooperated with the members of IEEE CPMT Japan Chapter, refurbished the workshop, and started the new symposium - IEEE CPMT Symposium Japan. It will provide component, packaging, and manufacturing researchers who are extending their activities beyond borders with opportunities to exchange technical knowledge and perspective. The committee strongly encourages you to attend this symposium and participate in the discussion, to understand the technology trends and find the best targets for your technology / business development. Bring your latest research results and share with the participants who are experts from the industry and the grove of Academe, and discuss with them. 　Anybody contributing to the achievement of a sustainable society through electronics is very welcome at this symposium.