IEEE CPMT Symposium Japan,
formerly VLSI Package Workshop in Japan

Aug.24 - 26, 2010


The University of Tokyo, Sanjo Conference Hall

 

The University of Tokyo, Yasuda Auditorium

 Deadline for abstract submission has been extended to
March 8, 2010
ICSJ 2010 is your chance to present your research results to a high-caliber professional audience.
Please submit your abstract to our symposium.

Technical Topics of this Workshop

System in a Package (SiP)

MEMS Packaging Technologies

Advanced Fine Pitch Packaging

Nanotechnology

3D Packaging & COC (Chip on Chip)           

Micro Bumping Technology

Wafer Level CSP

Electrical Performance & Thermal Management

Packaging for Optoelectronics

Failure Mechanisms & Reliability Improvement

Packaging for Automobile

Materials for High Speed Application &
Wafer Process

RF Components & Modules / RF Tags

Green Material

Assembly and Packaging Challenges for
Cu/Low-k Chips

Integrated Passives /Embedded Components

Laminated Materials & Processing

Emerging Technologies

Board level reliability System in a Package (SiP)

 


 Last updated:  2010/ 2/23
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