IEEE CPMT Symposium Japan,
formerly VLSI Package Workshop in Japan
Aug.24 - 26, 2010

The University of Tokyo, Sanjo Conference Hall

 

The University of Tokyo, Yasuda Auditorium

 Deadline for abstract submission has been extended to
March 8, 2010
ICSJ 2010 is your chance to present your research results to a high-caliber professional audience.
Please submit your abstract to our symposium.

Technical Topics of this Workshop

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System in a Package (SiP)

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MEMS Packaging Technologies

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Advanced Fine Pitch Packaging

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Nanotechnology

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3D Packaging & COC (Chip on Chip)           

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Micro Bumping Technology

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Wafer Level CSP

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Electrical Performance & Thermal Management

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Packaging for Optoelectronics

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Failure Mechanisms & Reliability Improvement

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Packaging for Automobile

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Materials for High Speed Application &
Wafer Process

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RF Components & Modules / RF Tags

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Green Material

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Assembly and Packaging Challenges for
Cu/Low-k Chips

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Integrated Passives /Embedded Components

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Laminated Materials & Processing

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Emerging Technologies

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Board level reliability System in a Package (SiP)

 
 Last updated:  2010/ 2/23
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